Adsorption of copper from the sulphate solution of low copper contents using the cationic resin Amberlite IR 120.

Manis Kumar Jha, Nghiem Van Nguyen, Jae-chun Lee, Jinki Jeong, Jae-Min Yoo

Minerals and Materials Processing Division, Korea Institute of Geoscience and Mineral Resources (KIGAM), 92 Gwahang-no, Yuseong-gu, Daejeon 305-350, South Korea.

Journal of hazardous materials 2009 May 30

filter terms:

In view of the increasing importance of the waste processing and recycling to meet the strict environmental regulations, the present investigation reports an adsorption process using the cationic exchanger Amberlite IR 120 for the recovery/removal of copper from the synthetic sulphate solution containing copper CMP waste effluent of electronic industry. Various process parameters, viz. contact time, solution pH, resin dose, and acid concentration of eluant were investigated for the adsorption of copper from the effluents. The 99.99% copper was found to be adsorbed from the sulphate solution containing copper 0.3-0.7 mg/mL of solution (feed pH 5) at A/R ratio 100 and eq. pH 2.5 in contact time 14 min. The mechanism for the adsorption of copper was found to follow Langmuir isotherm and second order rate. From the loaded organic, copper was eluted effectively by 1.8M sulphuric acid at A/R ratio 25. The raffinate obtained after the recovery copper could be disposed safely without affecting the environment.

Citation

Manis Kumar Jha, Nghiem Van Nguyen, Jae-chun Lee, Jinki Jeong, Jae-Min Yoo. Adsorption of copper from the sulphate solution of low copper contents using the cationic resin Amberlite IR 120. Journal of hazardous materials. 2009 May 30;164(2-3):948-53