A Novel Finger Vein Recognition Method Based on Aggregation of Radon-Like Features.

Qiong Yao, Dan Song, Xiang Xu, Kun Zou

Sensors (Basel, Switzerland) 2021 Mar 08

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Finger vein (FV) biometrics is one of the most promising individual recognition traits, which has the capabilities of uniqueness, anti-forgery, and bio-assay, etc. However, due to the restricts of imaging environments, the acquired FV images are easily degraded to low-contrast, blur, as well as serious noise disturbance. Therefore, how to extract more efficient and robust features from these low-quality FV images, remains to be addressed. In this paper, a novel feature extraction method of FV images is presented, which combines curvature and radon-like features (RLF). First, an enhanced vein pattern image is obtained by calculating the mean curvature of each pixel in the original FV image. Then, a specific implementation of RLF is developed and performed on the previously obtained vein pattern image, which can effectively aggregate the dispersed spatial information around the vein structures, thus highlight vein patterns and suppress spurious non-boundary responses and noises. Finally, a smoother vein structure image is obtained for subsequent matching and verification. Compared with the existing curvature-based recognition methods, the proposed method can not only preserve the inherent vein patterns, but also eliminate most of the pseudo vein information, so as to restore more smoothing and genuine vein structure information. In order to assess the performance of our proposed RLF-based method, we conducted comprehensive experiments on three public FV databases and a self-built FV database (which contains 37,080 samples that derived from 1030 individuals). The experimental results denoted that RLF-based feature extraction method can obtain more complete and continuous vein patterns, as well as better recognition accuracy.

Citation

Qiong Yao, Dan Song, Xiang Xu, Kun Zou. A Novel Finger Vein Recognition Method Based on Aggregation of Radon-Like Features. Sensors (Basel, Switzerland). 2021 Mar 08;21(5)